In‐situ curing of <scp>3D</scp> printed freestanding thermosets
Chongjie Gao, Jingjing Qiu, Shiren Wang
Abstract
Abstract Direct‐ink‐writing (DIW) provides a high‐efficiency way for thermoset printing while rapid in‐situ curing has a significant role in manufacturing rate, quality, performance, and flexibility. In this review, in‐situ curing methods that can be integrated into DIW were discussed, including frontal polymerization, electromagnetic heating, photochemistry, electron beam, and resistance heating curing. The in‐situ process monitoring and curing kinetic analysis technologies such as differential scanning calorimetry (DSC), Raman spectroscopy, Fourier transform infrared spectroscopy (FT‐IR), broadband dielectric spectroscopy (BDS), ultrasonic dynamic mechanical analysis (UDMA), fluorescence spectroscopy, were briefly presented. The working mechanism and features of these characterization measurements are studied. Furthermore, machine learning and other artificial intelligence tools used for the optimization of printing materials, topology design, printing path, and defect detection sensitivity are reviewed. Finally, some future research directions for the DIW and in‐situ curing of thermosets are addressed.