Low-temperature bonding of Si and polycrystalline diamond with ultra-low thermal boundary resistance by reactive nanolayers
Yi Zhong, Shuchao Bao, Ran He, Xiao‐Fan Jiang, Hengbo Zhang, Wenbiao Ruan, Mingchuan Zhang, Daquan Yu
Topics & Concepts
DiamondMaterials scienceSemiconductorOptoelectronicsWaferSiliconElectronicsEngineering physicsNanotechnologyThermal resistanceComposite materialThermalElectrical engineeringPhysicsEngineeringMeteorologyDiamond and Carbon-based Materials ResearchThermal properties of materialsAdhesion, Friction, and Surface Interactions