Litcius/Paper detail

Enhanced heat transfer of PCM-based heat sink augmented with plate-fins and hybrid nanoparticles for electronics cooling

Adeel Arshad, Mark Jabbal, Yuying Yan

2025International Journal of Thermal Sciences17 citationsDOI

Topics & Concepts

Materials scienceHeat sinkHeat transferElectronicsElectronics coolingFinHeat transfer enhancementEnhanced heat transferComposite materialMechanicsMechanical engineeringHeat transfer coefficientElectrical engineeringPhysicsEngineeringPhase Change Materials ResearchSolar Thermal and Photovoltaic SystemsHeat Transfer and Optimization