Litcius/Paper detail

Indium thermal interface material microstructure as a function of thermal history and bonding metallization

Peter McClure, Yujia Wang

2022Journal of Materials Science Materials in Electronics13 citationsDOI

Topics & Concepts

IndiumMaterials scienceMicrostructurePolishingSolderingFocused ion beamComposite materialIntermetallicThermal conductivityMetallurgyOptoelectronicsIonChemistryAlloyOrganic chemistryElectronic Packaging and Soldering TechnologiesThermal properties of materialsIntermetallics and Advanced Alloy Properties