AI-Powered Next-Generation Technology for Semiconductor Optical Metrology: A Review
Wenjia Xu, Houdao Zhang, L. L. Ji, Zhongyu Li
Abstract
As semiconductor manufacturing advances into the angstrom-scale era characterized by three-dimensional integration, conventional metrology technologies face fundamental limitations regarding accuracy, speed, and non-destructiveness. Although optical spectroscopy has emerged as a prominent research focus, its application in complex manufacturing scenarios continues to confront significant technical barriers. This review establishes three concrete objectives: To categorize AI-optical spectroscopy integration paradigms spanning forward surrogate modeling, inverse prediction, physics-informed neural networks (PINNs), and multi-level architectures; to benchmark their efficacy against critical industrial metrology challenges including tool-to-tool (T2T) matching and high-aspect-ratio (HAR) structure characterization; and to identify unresolved bottlenecks for guiding next-generation intelligent semiconductor metrology. By categorically elaborating on the innovative applications of AI algorithms-such as forward surrogate models, inverse modeling techniques, physics-informed neural networks (PINNs), and multi-level network architectures-in optical spectroscopy, this work methodically assesses the implementation efficacy and limitations of each technical pathway. Through actual application case studies involving J-profiler software 5.0 and associated algorithms, this review validates the significant efficacy of AI technologies in addressing critical industrial challenges, including tool-to-tool (T2T) matching. The research demonstrates that the fusion of AI and optical spectroscopy delivers technological breakthroughs for semiconductor metrology; however, persistent challenges remain concerning data veracity, insufficient datasets, and cross-scale compatibility. Future research should prioritize enhancing model generalization capability, optimizing data acquisition and utilization strategies, and balancing algorithm real-time performance with accuracy, thereby catalyzing the transformation of semiconductor manufacturing towards an intelligence-driven advanced metrology paradigm.