Multiscale modelling of curing-induced z-pin/composite interfacial cracks
Jisiyuan Cheng, Yingjie Xu, Weihong Zhang, Weiwei Liu
Topics & Concepts
Composite numberMaterials scienceCuring (chemistry)Composite materialStructural engineeringEngineeringMechanical Behavior of CompositesEpoxy Resin Curing ProcessesNumerical methods in engineering