Modeling of interfacial void closure and prediction of bonding time in solid-state diffusion bonding
Y. Peng, Zexiang Li, Wei Guo, Jiangtao Xiong, J.L. Li, J.L. Li
Topics & Concepts
Materials scienceVoid (composites)Closure (psychology)Diffusion bondingComposite materialSolid-stateDiffusionThermodynamicsEngineering physicsEngineeringEconomicsMarket economyPhysicsElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques Analysis3D IC and TSV technologies