Adhesive properties of deposited Cu films on colorless polyimide using high power impulse magnetron sputtering system
Yuan-Nan Tsai, Hsin-Yo Chen, I‐Hsiang Tseng, Jyh‐Wei Lee, Mei‐Hui Tsai, Ming-Syuan Li, Chih‐Hsing Wang, Chuen-Ming Gee, Tzu-Ling Chen, Pin-Chen Tsai
Topics & Concepts
Materials sciencePolyimideHigh-power impulse magnetron sputteringAdhesiveSputter depositionComposite materialSputteringImpulse (physics)OptoelectronicsCavity magnetronThin filmMetallurgyLayer (electronics)NanotechnologyQuantum mechanicsPhysicsMetal and Thin Film MechanicsSynthesis and properties of polymersTribology and Wear Analysis