Fast Thermal Analysis for Chiplet Design based on Graph Convolution Networks
Liang Chen, Wentian Jin, Sheldon X.-D. Tan
Abstract
2.5D chiplet-based technology promises an efficient integration technique for advanced designs with more functionality and higher performance. Temperature and related thermal optimization, heat removal are of critical importance for temperature-aware physical synthesis for chiplets. This paper presents a novel graph convolutional networks (GCN) architecture to estimate the thermal map of the 2.5D chiplet-based systems with the thermal resistance networks built by the compact thermal model (CTM). First, we take the total power of all chiplets as an input feature, which is a global feature. This additional global information can overcome the limitation that the GCN can only extract local information via neighborhood aggregation. Second, inspired by convolutional neural networks (CNN), we add skip connection into the GCN to pass the global feature directly across the hidden layers with the concatenation operation. Third, to consider the edge embedding feature, we propose an edge-based attention mechanism based on the graph attention networks (GAT). Last, with the multiple aggregators and scalers of principle neighborhood aggregation (PNA) networks, we can further improve the modeling capacity of the novel GCN. The experimental results show that the proposed GCN model can achieve an average RMSE of 0.31 K and deliver a 2.6× speedup over the fast steady-state solver of open-source HotSpot based on SuperLU. More importantly, the GCN model demonstrates more useful generalization or transferable capability. Our results show that the trained GCN can be directly applied to predict thermal maps of six unseen datasets with acceptable mean RMSEs of less than 0.67 K without retraining via inductive learning.