A universal high-efficiency cooling structure for high-power integrated circuits☆
Han Wang, Qing Wu, Chao Wang, Ru‐Zhi Wang
Topics & Concepts
Electronic circuitPower (physics)Materials scienceElectrical engineeringEngineering physicsMechanical engineeringEngineeringPhysicsThermodynamicsHeat Transfer and OptimizationThermal properties of materialsHeat Transfer and Boiling Studies