A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow
Jing Wang, Yuling Niu, Shuai Shao, Huayan Wang, Jiefeng Xu, Vanlai Pham, Seungbae Park
Topics & Concepts
Delamination (geology)SolderingFinite element methodReflow solderingMoistureElectronic packagingMaterials scienceReliability (semiconductor)Integrated circuit packagingMechanical engineeringPhysics of failureComposite materialFracture (geology)Structural engineeringEngineeringIntegrated circuitOptoelectronicsBiologyPaleontologyPhysicsSubductionTectonicsPower (physics)Quantum mechanicsMechanical Behavior of CompositesElectronic Packaging and Soldering TechnologiesHigh-Velocity Impact and Material Behavior