Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide
Juncheng Xia, Yue Qin, Xianzhe Wei, Linhong Li, Maohua Li, Xiangdong Kong, Shaoyang Xiong, Tao Cai, Wen Dai, Cheng‐Te Lin, Nan Jiang, Shuangquan Fang, Jian Yi, Jinhong Yu
Abstract
The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m−1 K−1, which is 470% higher than that of pure polymer. The results show that using the filler with a new structure to construct thermal conductivity networks is an effective way to improve the thermal conductivity of PVDF. This work provides a new idea for the further application in the field of electronic packaging.