Modeling of flip-chip underfill delamination and cracking with five input manufacturing variables
Ying Yang, Mamadou Kabirou Touré, Papa Momar Souaré, Éric Duchesne, Julien Sylvestre
Topics & Concepts
Flip chipDelamination (geology)Wafer dicingMaterials scienceComposite materialChipStructural engineeringFinite element methodEngineeringAdhesiveElectrical engineeringLayer (electronics)PaleontologyBiologyTectonicsSubductionIntegrated Circuits and Semiconductor Failure AnalysisElectronic Packaging and Soldering TechnologiesNon-Destructive Testing Techniques