Experimental investigation of roll bond liquid cooling plates for server chip heat dissipation
Haozhong Hu, Chaomeng Chen, Chao Li, Minqiang Pan
Topics & Concepts
Materials scienceVolumetric flow rateBendingHeat transferFlow (mathematics)Computer coolingMechanicsDissipationThermodynamicsMechanical engineeringComposite materialThermal management of electronic devices and systemsEngineeringPhysicsHeat Transfer and OptimizationHeat Transfer and Boiling StudiesHeat Transfer Mechanisms