Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition
Yulei Yuan, Houya Wu, Junjie Li, Pengli Zhu, Rong Sun
Topics & Concepts
SinteringNanoparticleMaterials scienceJoint (building)MetallurgyCopperChemical engineeringComposite materialNanotechnologyEngineeringArchitectural engineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties