Development of High-Density Hybrid Substrate for Heterogeneous Integration
Chia-Yu Peng, John H. Lau, Cheng-Ta Ko, Paul Lee, Eagle Lin, Henry Yang, Puru Bruce Lin, Tim Xia, Leo Chang, Curry Lin, Tzu Nien Lee, Jason Wong, Mike Ma, Tzyy-Jang Tseng
Abstract
The fan-out chip-last panel-level packaging for chiplets heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, and fabrication of a high-density organic hybrid substrate using an interconnect-layer.
Topics & Concepts
InterconnectionFabricationEmphasis (telecommunications)Substrate (aquarium)Materials scienceProcess (computing)ChipSystem on a chipIntegrated circuit packagingLayer (electronics)OptoelectronicsProcess integrationComputer scienceElectronic engineeringNanotechnologyEngineering physicsProcess engineeringIntegrated circuitEngineeringEmbedded systemTelecommunicationsGeologyOperating systemOceanographyMedicinePathologyAlternative medicine3D IC and TSV technologiesSemiconductor Lasers and Optical DevicesModular Robots and Swarm Intelligence