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Synthesis of High-Performance Colorless Polyimides with Asymmetric Diamine: Application in Flexible Electronic Devices

Yanyu Gao, Weifeng Peng, Jian Wei, Dechao Guo, Yunjie Zhang, Qianqian Yu, Cheng Wang, Linge Wang

2024ACS Applied Materials & Interfaces54 citationsDOI

Abstract

Colorless polyimides (CPIs) are widely used as high-performance materials in flexible electronic devices. From a molecular design standpoint, the industry continues to encounter challenges in developing CPIs with desired attributes, including exceptional optical transparency, excellent thermal stability, and enhanced mechanical strength. This study presents and validates a method for controlling 2-substituents, with a specific emphasis on examining how these substituents affect the thermal, mechanical, optical, and dielectric characteristics of CPIs. The presence of two CF 3 groups on the same side of the diamine structure ensured the transmittance of the film. The charge transfer effect and the molecular distance are dynamically regulated by changing the 2-substituent (–OCH 3 /–CH 3 /H/F). The polyimide exhibited a well-maintained equilibrium between transparency and thermal stability, with a T 500nm value ranging from 86.2 to 89.6% in the visible region, and a glass transition temperature ( T g ) ranging from 358.6 to 376.0 °C. Additionally, the 6FDA-2-MTFMB compound, when combined with methyl, excels as a protective layer and base material, exhibiting excellent performance in various aspects. It has been verified as an appropriate option for flexible photodetectors and wearable piezoresistive sensors. In summary, this systematic investigation will provide a comprehensive and demonstrative methodology for developing CPIs that are capable of adapting to flexible electronic devices.

Topics & Concepts

Materials scienceOptical transparencyDiamineThermal stabilityTransparency (behavior)ThermalDielectricElectronicsMechanical strengthNanotechnologyOptoelectronicsChemical engineeringComposite materialPolymer chemistryPhysical chemistryComputer scienceThermodynamicsEngineeringPhysicsChemistryComputer securitySynthesis and properties of polymersEpoxy Resin Curing ProcessesSilicone and Siloxane Chemistry