A numerical study on slurry flow with CMP pad grooves
Seok‐Jun Hong, Sung-Hoon Bae, Seulgi Choi, Pengzhan Liu, Hojoong Kim, Taesung Kim
Topics & Concepts
SlurryGroove (engineering)Materials scienceChemical-mechanical planarizationWaferComposite materialPolishingFlow (mathematics)Rotational speedRotation (mathematics)Volumetric flow rateMechanicsMechanical engineeringMetallurgyGeometryMathematicsEngineeringPhysicsNanotechnologyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdhesion, Friction, and Surface Interactions