Analysis of crack-free surface generation of photovoltaic polysilicon wafer cut by diamond wire saw
Youkang Yin, Yufei Gao, Liyuan Wang, Lei Zhang, Tianzhao Pu
Topics & Concepts
Materials scienceWaferWire speedDiamondBrittlenessMachiningComposite materialMechanical engineeringOptoelectronicsMetallurgyEngineeringAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchTunneling and Rock Mechanics