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Microstructure changes in Sn-Bi solder joints reinforced with Zn@Sn particles in thermal cycling and thermomigration

Fengyi WANG, Ziwen Lv, Linxiao Sun, Hongtao Chen, Mingyu LI

2023Journal of the Taiwan Institute of Chemical Engineers19 citationsDOI

Topics & Concepts

SolderingMaterials scienceTemperature cyclingEutectic systemNucleationMicrostructureMetallurgyPhase (matter)Shear strength (soil)Plating (geology)Composite materialThermalThermodynamicsGeologySoil scienceChemistrySoil waterOrganic chemistryEnvironmental sciencePhysicsGeophysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties
Microstructure changes in Sn-Bi solder joints reinforced with Zn@Sn particles in thermal cycling and thermomigration | Litcius