Reduction of formaldehyde emission from medium density fiberboard using nanoclay modified with 3-aminopropyltriethoxysilane and l-Lysine as additives to urea-formaldehyde adhesive
Leila Asadi Khorramabadi, Rabi Behrooz, Saeed Kazemi Najafi
Topics & Concepts
FormaldehydeMaterials scienceAdhesiveUrea-formaldehydeComposite materialSwellingAbsorption of waterFourier transform infrared spectroscopyFiberboardYoung's modulusChemical engineeringChemistryOrganic chemistryEngineeringLayer (electronics)Nanocomposite Films for Food PackagingAdvanced Cellulose Research StudiesNatural Fiber Reinforced Composites