Direct additive copper plating on polyimide surface with silver ammonia via plasma modification
Junlun Xiang, Guoyun Zhou, Yan Hong, Wei He, Shouxu Wang, Yuanming Chen, Chong Wang, Yao Tang, Yukai Sun, Yongkang Zhu
Topics & Concepts
PolyimideCopperMaterials scienceAmmoniaCopper platingChemical engineeringSurface modificationElectrical resistivity and conductivityPlating (geology)Surface roughnessSubstrate (aquarium)Inorganic chemistryMetallurgyLayer (electronics)NanotechnologyComposite materialChemistryOrganic chemistryElectroplatingOceanographyElectrical engineeringGeologyGeophysicsEngineeringAdvanced Sensor and Energy Harvesting MaterialsNanomaterials and Printing TechnologiesSurface Modification and Superhydrophobicity