Litcius/Paper detail

Investigation of abrasive-free slurry for polysilicon buffing chemical mechanical planarization

Sanghuck Jeon, Jiah Hong, Seok‐Jun Hong, Chaitanya Kanade, Kihong Park, Hyunho Seok, Hojoong Kim, Sunyoung Lee, Taesung Kim

2021Materials Science in Semiconductor Processing18 citationsDOI

Topics & Concepts

Chemical-mechanical planarizationMaterials scienceX-ray photoelectron spectroscopyZeta potentialSlurryPEG ratioSurface roughnessAttenuated total reflectionChemical engineeringPassivationEthylene glycolFourier transform infrared spectroscopyEtching (microfabrication)AdsorptionPolishingAbrasiveComposite materialSurface finishLayer (electronics)NanotechnologyNanoparticleOrganic chemistryChemistryEconomicsEngineeringFinanceAdvanced Surface Polishing TechniquesForce Microscopy Techniques and ApplicationsDiamond and Carbon-based Materials Research