Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer
Koen Kennes, Alain Phommahaxay, Alice Guerrero, Olga Bauder, Samuel Suhard, Pieter Bex, Serena Iacovo, Xiao Liu, Thomas Schmidt, Gerald Beyer, Eric Beyne
Abstract
Current roadblocks within the collective die-to-wafer bonding flow, limiting die-transfer yield and throughput, are identified and discussed. Based on the obtained assessment a new carrier system is introduced. The use of the ultra-soft and highly-UV-transparent BrewerBOND <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">®</sup> C1301 material and its compatibility with BrewerBOND <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">®</sup> 701 laser release material, which is coated on top of ultra-thin dies, allows for a room temperature, ultra-low force collective bonding with laser-assisted die transfer sequence.