Detection of kissing bond type defects and evaluation of the bonding quality in metal/adhesive/composite structures by a wavenumber-frequency insensitive SH mode
Latifa Attar, Mounsif Ech Cherif El Kettani, D. Leduc, Mihai Valentin Predoi, J. Galy
Topics & Concepts
AdhesiveMaterials scienceAdhesionComposite numberComposite materialWavenumberEpoxySubstrate (aquarium)Work (physics)Adhesive bondingLayer (electronics)AcousticsOpticsEngineeringPhysicsMechanical engineeringGeologyOceanographyUltrasonics and Acoustic Wave PropagationNon-Destructive Testing TechniquesStructural Health Monitoring Techniques