Microstructure evolution and mechanical behavior of copper through‑silicon via structure under thermal cyclic loading
Mingqi Lei, Yuexing Wang, Xiaofeng Yang, Yao Yao
Topics & Concepts
MicrostructureCopperMaterials scienceThermalSiliconComposite materialMetallurgyPhysicsMeteorologyAluminum Alloys Composites PropertiesMicrostructure and mechanical propertiesAdvanced Welding Techniques Analysis