Solvent-free encapsulation of curing agents for high performing one-component epoxy adhesives
Sung Min Jee, Cheol‐Hee Ahn, Jong Hyuk Park, Tae Ann Kim, Min Park
Topics & Concepts
AdhesiveMaterials scienceEpoxyComposite materialCuring (chemistry)Epoxy adhesiveCoatingComposite epoxy materialThermal stabilityChemical engineeringLayer (electronics)EngineeringSynthesis and properties of polymersGraphene research and applicationsEpoxy Resin Curing Processes