Litcius/Paper detail

A 0.297-pJ/Bit 50.4-Gb/s/Wire Inverter-Based Short-Reach Simultaneous Bi-Directional Transceiver for Die-to-Die Interface in 5-nm CMOS

Yoshinori Nishi, John W. Poulton, Walker J. Turner, Xi Chen, Sanquan Song, Brian Zimmer, Stephen G. Tell, Nikola Nedovic, John Wilson, William J. Dally, C. Thomas Gray

2023IEEE Journal of Solid-State Circuits56 citationsDOI

Abstract

This article presents a clock-forwarded, inverter-based short-reach simultaneous bi-directional (ISR-SBD) physical layer (PHY) targeted for die-to-die communication over silicon interposers or similar high-density interconnect. Short-reach links of this type are increasingly important to support larger systems built with chiplets and multiple die and to facilitate the shift to medium- and long-range optical communication based on silicon photonics. This project explores the advantages of simultaneous bi-directional signaling (SBD) over other bandwidth-doubling techniques (e.g., PAM4). Fabricated in a 5-nm standard CMOS process, the ISR-SBD PHY demonstrates 50.4 Gb/s/wire (25.2 Gb/s each direction) and 0.297 pJ/bit on a 750-mV supply over a 1.2-mm on- chip channel.

Topics & Concepts

Die (integrated circuit)TransceiverInverterCMOSPhotonicsInterposerChipElectrical engineeringElectronic engineeringOptoelectronicsMaterials scienceComputer scienceEngineeringVoltageLayer (electronics)NanotechnologyEtching (microfabrication)Interconnection Networks and SystemsPhotonic and Optical DevicesSemiconductor Lasers and Optical Devices
A 0.297-pJ/Bit 50.4-Gb/s/Wire Inverter-Based Short-Reach Simultaneous Bi-Directional Transceiver for Die-to-Die Interface in 5-nm CMOS | Litcius