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Effects of cutting parameters on the subsurface damage of single crystal copper during nanocutting process

Ping Zhang, Xian Long Cao, Xiancheng Zhang, Youqiang Wang

2020Vacuum40 citationsDOI

Topics & Concepts

DislocationCopperMaterials scienceSingle crystalCrystal (programming language)Molecular dynamicsCrystallographyMetallurgyComposite materialChemistryComputer scienceComputational chemistryProgramming languageMicrostructure and mechanical propertiesAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure Analysis
Effects of cutting parameters on the subsurface damage of single crystal copper during nanocutting process | Litcius