The effect of bonding process parameters on the microstructure and mechanical properties of AA5083 diffusion-bonded joints
S. Venugopal, M. Seeman, R. Seetharaman, V. Jayaseelan
Abstract
Diffusion bonding is a sort of solid-state joining that allows the joining of metals with similar and dissimilar compositions by allowing them to diffuse into one another. The current study investigated the impact of process parameters on the bonding strength of AA5083. The process parameters were considered as bonding temperature, holding time, and bonding pressure. Because of micro-constituent diffusion in the interface, the bonding and shear strengths increased as pressure and temperature were raised in the sample. By increasing the temperature of the Al3Mg2 particles from 490 °C to 520 °C and the bonding pressure from 5 MPa to 15 MPa, the dispersion of secondary phase particles is improved, and pores/defects in bonded joints are reduced. Furthermore, microstructural characterization reveals that the achieved strength is contingent on boundary grain growth and grain boundary migration through the bonding process, respectively. The light optical microscope was used to characterize the microstructural test and diffusion layer configuration at the boundary.