Transient liquid phase bonding (TLPB) of Cu to Cu using Sn interconnect solder reinforced by submicron Al particles
Lei Sun, Liang Zhang, Chun-chun Wei, Minghe Chen, Yi Zhang
Topics & Concepts
Materials scienceSolderingInterconnectionMicrostructureComposite materialWettingShear strength (soil)Layer (electronics)Phase (matter)Indentation hardnessFlip chipMetallurgyAdhesiveEnvironmental scienceComputer scienceComputer networkOrganic chemistrySoil scienceSoil waterChemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesInjection Molding Process and Properties