Effect of different pulse modes during Cl2/Ar inductively coupled plasma etching on the characteristics of nanoscale silicon trench formation
Hee‐Ju Kim, Long Wen, Doo San Kim, Ki Hyun Kim, Jong Woo Hong, Won Jun Chang, Soo Namgoong, Dong Woo Kim, Geun Young Yeom
Topics & Concepts
Etching (microfabrication)TrenchSiliconInductively coupled plasmaSelectivityMaterials scienceNanoscopic scaleOptoelectronicsPlasmaAnalytical Chemistry (journal)Pulse (music)Layer (electronics)ChemistryNanotechnologyOpticsQuantum mechanicsDetectorPhysicsChromatographyCatalysisBiochemistrySemiconductor materials and devicesPlasma Diagnostics and ApplicationsAdvanced Surface Polishing Techniques