Analysis of the material removal mechanism in chemical mechanical polishing with in-situ macroscale nonwoven pad contact interface observation using an evanescent field
Michio Uneda, Naoki Kubo, Mizuki Hatatani, Kazutoshi Hotta, Hitoshi Morinaga
Topics & Concepts
PolishingConsumablesChemical-mechanical planarizationSlurryMaterials scienceComposite materialContact areaMetallurgyChemistryPhysical chemistryAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationForce Microscopy Techniques and Applications