Localized surface roughening to improve adhesion of electroless seed layer in through-glass vias
Harsh Pandey, Karan Pawar, Pradeep Dixit
Topics & Concepts
Materials scienceLayer (electronics)AdhesionComposite materialSurface (topology)NanotechnologyGeometryMathematicsElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesSemiconductor materials and interfaces