Optimized dielectric performance in bismaleimide–triazine resin <i>via</i> a dual-modification strategy for high-frequency electronic packaging
Hao Wang, Kang Luo, Enzhu Li, Xing Zhang, Ying Yuan
Abstract
High-speed and high-quality signal transmission in the fifth-generation mobile communication system poses significant challenges for the dielectric properties and operational reliability of existing electronic packaging materials.
Topics & Concepts
Materials scienceReliability (semiconductor)DielectricTriazineElectronic packagingOptoelectronicsTransmission (telecommunications)Composite materialDual (grammatical number)SIGNAL (programming language)Dielectric lossComputer scienceTelecommunicationsPolymer chemistryPhysicsLiteratureProgramming languageQuantum mechanicsArtPower (physics)Synthesis and properties of polymersEpoxy Resin Curing Processes3D IC and TSV technologies