A highly bendable thin film encapsulation by the modulation of thermally induced interfacial residual stress
Yong Cheon Park, Taehyun Kim, Hye Rin Shim, YoungWoo Choi, Seungbum Hong, Seunghyup Yoo, Sung Gap Im
Topics & Concepts
Materials scienceResidual stressAtomic layer depositionComposite materialFabricationChemical vapor depositionThin filmCopolymerBend radiusPolymerUltimate tensile strengthThermal stabilityBrittlenessBendingLayer (electronics)NanotechnologyChemical engineeringMedicineAlternative medicineEngineeringPathologyAdvanced Sensor and Energy Harvesting MaterialsAdhesion, Friction, and Surface InteractionsSemiconductor materials and devices