Dismantlable Adhesion Interface Featuring a Thermo/Photocleavable Molecular Layer
Miho Aizawa, Haruhisa Akiyama, Yoko Matsuzawa
Abstract
Dismantlable adhesion systems are becoming increasingly important in industrial applications, as they facilitate the recycling of a range of materials. Many dismantlable adhesives have been developed in response to this demand; however, their dismantling mechanisms are limited to those that utilize changes in bulk state. Herein, a novel dismantling adhesion system that enables the adhesion strength to be reduced based on covalent bond change is proposed. This is achieved by using a thermo‐ and photocleavable molecular layer comprising an anthracene photodimer. The molecular layer applied at the adhesion interface exhibits an adhesion strength twice that of the uncoated substrate, based on the formation of covalent bonds between the substrates and adhesives. Heating the adhered specimen for 1 min successfully reduces the peel strength by 60% and induces dismantling at the molecular layer. Furthermore, it is possible to dismantle adhesive joint through a low‐energy photocleavage process with light irradiation. This process requires under 10% of the energy of other light‐triggered dismantlable adhesives. The proposed system provides new insights for the development of dismantlable adhesion technology, leveraging the adhesion mechanism at the interface.