Model-assisted reliability assessment for adhesive bonding quality evaluation with ultrasonic NDT
Bengisu Yılmaz, Damira Smagulova, Elena Jasiūnienė
Topics & Concepts
Ultrasonic sensorMaterials scienceAdhesiveNondestructive testingUltrasonic testingReliability (semiconductor)Parametric statisticsTime domainAcousticsSIGNAL (programming language)Adhesive bondingEpoxyFrequency domainAttenuationStructural engineeringComposite materialComputer scienceEngineeringOpticsPhysicsMathematicsLayer (electronics)Programming languageStatisticsQuantum mechanicsPower (physics)Computer visionUltrasonics and Acoustic Wave PropagationNon-Destructive Testing TechniquesStructural Health Monitoring Techniques