Origins of HDI stress in copper–brass laminates with dual-heterostructured interfaces
Zhongchen Zhou, Yanfei Wang, Jiansheng Li, Qingzhong Mao, Yi Liu, Yue Yu, Yusheng Li
Topics & Concepts
Materials scienceBrassCopperDual (grammatical number)Stress (linguistics)Composite materialMetallurgyPhilosophyLinguisticsArtLiteratureMaterial Properties and ApplicationsAdditive Manufacturing and 3D Printing TechnologiesLaser and Thermal Forming Techniques