Breaking strength-conductivity trade-off in nanotwinned Cu by Fe Co-electroplating and its thermal stability characterization
Dinh-Phuc Tran, Bo-Yan Chen, Mai-Phuong La, Kang-Ping Lee, Chih Chen
Topics & Concepts
Materials scienceElectroplatingCharacterization (materials science)Thermal conductivityThermal stabilityBreaking strengthComposite materialMetallurgyNanotechnologyChemical engineeringLayer (electronics)EngineeringCopper Interconnects and ReliabilityAluminum Alloys Composites PropertiesElectrodeposition and Electroless Coatings