Efficient and slurryless ultrasonic vibration assisted electrochemical mechanical polishing for 4H–SiC wafers
Xiaozhe Yang, Xu Yang, Haiyang Gu, Kentaro Kawai, Kenta Arima, Kazuya Yamamura
Topics & Concepts
PolishingMaterials scienceWaferChemical-mechanical planarizationSurface roughnessUltrasonic sensorVibrationGrindingSurface finishComposite materialResidual stressOptoelectronicsAcousticsPhysicsAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure AnalysisSemiconductor materials and devices