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Experimental investigation on thermal characteristics of a novel loop heat pipe for cooling high heat flux electronic chips

Kangning Xiong, Like Meng, Shuangfeng Wang, L. Winston Zhang

2022International Journal of Heat and Mass Transfer50 citationsDOI

Topics & Concepts

Loop heat pipeMaterials scienceHeat sinkHeat fluxMicro-loop heat pipeEvaporatorHeat pipeThermal resistanceComposite materialThermalThermodynamicsHeat transferMechanicsHeat spreaderHeat exchangerPhysicsHeat Transfer and Boiling StudiesHeat Transfer and OptimizationRefrigeration and Air Conditioning Technologies
Experimental investigation on thermal characteristics of a novel loop heat pipe for cooling high heat flux electronic chips | Litcius