High performance epoxy resin with ultralow coefficient of thermal expansion cured by conformation-switchable multi-functional agent
Qiangsheng Sun, Yudi Feng, Jia Guo, Changchun Wang
Topics & Concepts
EpoxyDiamineMaterials scienceThermal expansionCuring (chemistry)Composite materialUltimate tensile strengthThermal stabilityPolymer chemistryChemistryOrganic chemistryEpoxy Resin Curing ProcessesSynthesis and properties of polymersThermal Expansion and Ionic Conductivity