Study on the effect of ceria concentration on the silicon oxide removal rate in chemical mechanical planarization

Donggeon Kwak, Seungjun Oh, Juhwan Kim, Jung‐Ho Yun, Taesung Kim

2020Colloids and Surfaces A Physicochemical and Engineering Aspects43 citationsDOI

Topics & Concepts

Chemical-mechanical planarizationAdsorptionChemical engineeringMaterials scienceWaferSlurryAbrasiveOxideSiliconLayer (electronics)Silicon oxideParticle (ecology)Particle sizeInorganic chemistryComposite materialNanotechnologyChemistryMetallurgyOrganic chemistryEngineeringSilicon nitrideGeologyOceanographyAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchAdvanced machining processes and optimization