IMC Growth and Mechanical Properties of Cu/In-48Sn/Cu Solder Joints
Zheng Liu, Li Yang, Kai Lü, Yao Cheng Zhang, Yu Xu, Feng Xu, Hui Gao
Topics & Concepts
SolderingIntermetallicMaterials scienceShear strength (soil)Phase (matter)Shear (geology)Composite materialGrowth rateJoint (building)KineticsMetallurgyDiffusionChemistryThermodynamicsStructural engineeringAlloyGeometryPhysicsSoil waterOrganic chemistryQuantum mechanicsMathematicsSoil scienceEngineeringEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis