Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes
Min Zhang, Fei Qin, Si Chen, Yanwei Dai, Pei Chen, Tong An
Topics & Concepts
Materials scienceAnnealing (glass)Through-silicon viaComposite materialCoppervon Mises yield criterionFinite element methodGrain sizeMicrostructureSiliconStackingResidual stressMetallurgyStructural engineeringNuclear magnetic resonanceEngineeringPhysics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties