Effect of Sn Addition on Microstructure, Aging Properties and Softening Resistance of Cu-Cr Alloy
Gaolei Xu, Yunqing Zhu, Lijun Peng, Haofeng Xie, Zengde Li, Shuhui Huang, Zhen Yang, Wenjing Zhang, Xujun Mi
Abstract
The relationship between microstructure evolution and properties of a Cu-Cr-Sn alloy during aging and high-temperature softening was investigated in detail in the present work. The results show that the addition of Sn refines obviously the size of the Cr phase and enhances the thermal stability of the alloy, which improves the peak-aged hardness of the Cu-Cr-Sn alloy reaching 139 HV after aging at 450 °C for 240 min. In addition, the recrystallization behavior of the Cu-Cr alloy with the 0.12 wt.% of Sn at high temperature is also significantly inhibited. Lots of precipitated Cr phases and a high density of dislocations are found in the Cu-Cr-Sn alloy annealed at high temperature, resulting in the softening temperature of the Cu-Cr-Sn alloy reaching 565 °C, which is higher than (about 50 °C) that of the Cu-Cr alloy.