Thermal instability of nanocrystalline Cu enables Cu-Cu direct bonding in interconnects at low temperature
Y. Wang, Yu‐Ting Huang, Y.X. Liu, Shien‐Ping Feng, Mingxin Huang
Topics & Concepts
Materials scienceNanocrystalline materialAnnealing (glass)Anodic bondingCopperDirect bondingThermal stabilityComposite materialWire bondingMetallurgyNanotechnologySiliconChemical engineeringElectrical engineeringEngineeringChip3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties