Machine learning enables accurate wire loop profile prediction for advanced microelectronics packaging
Maoxiang Hou, Zhengping Ou, Junyu Long, Shuquan Ding, Guanhai Wen, Yun Chen, Xin Chen
Topics & Concepts
Support vector machineWire bondingMicroelectronicsAlgorithmHyperparameterFinite element methodComputer scienceArtificial intelligenceMaterials scienceChipEngineeringStructural engineeringTelecommunicationsOptoelectronicsElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability3D IC and TSV technologies