Improvement of the heat resistance of a liquid mold compound by bismaleimide resin
Yuki Ishikawa, Tomoya Takao, Takeyasu Saito
Topics & Concepts
EpoxyMoldMaleimideMaterials scienceHeat resistanceCuring (chemistry)Composite materialMelting pointGlass transitionSiliconeBisphenol AEpoxidePolymer chemistryPolymerChemistryOrganic chemistryCatalysisEpoxy Resin Curing ProcessesSynthesis and properties of polymersMechanical Behavior of Composites